The alternative to hydraulically setting levelling and smoothing compounds: With its optimised, narrow-band grain distribution combined with the specially elongated grain shape of the individual chip, the product is particularly suitable for the traditional area of application of hydraulically setting levelling and smoothing compounds. CW020 is an innovative new development for thin-layer levelling up to 20 millimetres on ceiling panels. CW020 is applied dry and is a quick and inexpensive alternative solution to the conventional systems.
Key points :
For zero levelling areas
Resistant to mould, fungi, rodents
No swelling or shrinkage
Low weight
Quick processing without water
No binders
Can be walked on immediately after application
No waste material
Specification :
Chip size: 1-2mm Fire behaviour: Class Bfl-S1 Thermal conductivity: 0.085W/mK Bulk density: approx. 320kg/m³ Uniform load distribution: 3.2kg per cm Installation height: 0-20mm Packaging unit: 50 litres
Applications
Levelling fill on Concrete ceilings Screed surfaces Wooden ceilings
Datasheets & Documents.
If you require a datasheet for this product please get in touch.
If you require a Safety datasheet (SDS) for this product please get in touch.
If you require a BBA Certificate for this product please get in touch.
